Neousys Nuvo 7000 LP

1

2

3

The new Neousys Nuvo 7000 LP powered by Intel® 8th-Gen Core™ i processors with up to 6-core/ 12-thread architecture that offer a significant performance improvement over previous 6th or 7th-Gen platforms. Neousys Nuvo 7000 LP powered by Intel® Coffee lake Core™ processor running with advanced Intel® Q370 chipset, The Nuvo-7000 series fanless embedded computer provides outstanding performance for emerging high-end requirement than 6th & 7th generations.

Info

Description

Nuvo-7000LP series is a derivative of Nuvo-7000 series that features the same level of ruggedness and versatility in a 79mm low-profile chassis. In addition to effective fanless design, proprietary MezIO™ interface and plethora of on-board I/O interfaces, Nuvo-7000LP series features one front-accessible, hot-swappable HDD/ SSD tray which can be configured as RAID 0/1 when combined with the internal SATA port. It also leverages cutting-edge M.2 NVMe SSD technology for over 2000MB/s disk read/ write speed, or install an Intel® Optane™ memory for the ultimate system acceleration.

Neousys Nuvo-7000LP series consolidates the latest Intel hexa-core CPU, high-speed I/O interfaces, super-fast disk access and flexible storage configuration to form a high-performance ruggedized embedded computer. In addition, you can also take advantage of the built-in MezIO™ interface to add on modules for application-specific I/Os.

Specification

System Core
Processor	Supporting Intel® 8th-Gen Coffee Lake 6-core CPU (LGA1151 socket, 35W/ 65W TDP) – Intel® Core™ i7-8700/ i7-8700T – Intel® Core™ i5-8500/ i5-8500T – Intel® Core™ i3-8100/ i3-8100T – Intel® Pentium® G5400/ G5400T – Intel® Celeron® G4900/ G4900T
Chipset	Intel® Q370 Platform Controller Hub
Graphics	Integrated Intel® UHD Graphics 630
Memory	Up to 32 GB DDR4 2666/2400 SDRAM (two SODIMM slots)
AMT	Supports AMT 12.0
TPM	Supports TPM 2.0

I/O Interface
Ethernet Port	2x Gigabit Ethernet ports by I219 and I210 (Nuvo-7002LP) 6x Gigabit Ethernet ports by I219 and 5x I210 (Nuvo-7006LP)
POE+	Optional IEEE 802.3at PoE+ PSE for Port 3 ~ Port 6 100 W total power budget
USB	4x USB 3.1 Gen2 (10 Gbps) ports 4x USB 3.1 Gen1 (5 Gbps) ports
Video Port	1x VGA connector, supporting 1920 x 1200 resolution 1x DVI-D connector, supporting 1920 x 1200 resolution 1x DisplayPort connector, supporting 4096 x 2304 resolution
Serial Port	2x software-programmable RS-232/422/485 ports (COM1/ COM2) 2x RS-232 ports (COM3/ COM4)
Audio	1x 3.5 mm jack for mic-in and speaker-out

Internal Expansion Bus
Mini PCI-E	1x full-size mini PCI Express socket with internal SIM socket (mux with mSATA)
M.2	1x M.2 2242 B key socket with dual front-accessible SIM sockets
Expandable I/O	1x MezIO™ expansion port for Neousys MezIO™ modules

Storage interface
SATA HDD	1x front-accessible, hot-swappable 2.5″ HDD/SSD tray 1x internal SATA port for 2.5″ HDD/SSD installation, supporting RAID 0/ 1
M.2	1x M.2 2280 M key socket (PCIe Gen3/ x4) for NVMe SSD or Intel® OptaneTM memory installation
mSATA	1x full-size mSATA port (mux with mini-PCIe)

Power Supply
DC Input	1x 3-pin pluggable terminal block for 8~35VDC DC input
Remote Ctrl. & Status Output	1x 3-pin pluggable terminal block for remote control and PWR LED output

Mechanical
Dimension	240 mm (W) x 225 mm (D) x 79 mm (H)
Weight	3.1 kg
Mounting	Wall-mounting (standard) or DIN-Rail mounting (optional)

Environmental
Operating temperature	with 35W CPU -25°C ~ 70°C with 65W CPU** -25°C ~ 70°C /* (configured as 35W TDP) -25°C ~ 50°C /* (configured as 65W TDP)
Storage temperature	-40°C ~ 85°C
Humidity	10% ~ 90% , non-condensing
Vibration	Operating, MIL-STD-810G, Method 514.6, Category 4
Shock	Operating, MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II
EMC	CE/FCC Class A, according to EN 55032 & EN 55024